DS-FC200 is a high-precision transfer system developed for chip products on turntables, designed for chip selection and placement. It supports multiple functions including 0-degree horizontal transfer, 90-degree rotation, and 180-degree flip rotation. It is widely applicable for sorting and transferring materials in industries such as optical communication, high-power laser chips, ceramic substrates, optical modules, chips, lenses, SM, capacitors, and more.

• Multi-Mode Support: Wafer to Tray, Wafer to Wafer; 0-degree horizontal movement, 90-degree rotation, 180-degree rotation
  

• Supports 6-12" Wafer Ring: Versatile for different wafer sizes
  

• Automatic Expansion System: Includes hot air guns for faster film expansion
  

• Dual-Station Simultaneous Detection: Improved efficiency by handling multiple tasks at once
  

• Secondary Calibration: Ensures accurate placement with a secondary correction system
  

• Easy Operation: Allows customization of chip search range, shape, and wafer spacing
  

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